Fuzzy gold electrodes for lowering impedance and improving adhesion with electrodeposited conducting polymer films

Sensors and Actuators, A: Physical

Volumn 103, Issue 3, 2003, Pages 384-394

  Cui, Xinyan ^a   Martin, David C ^a  

^a UNIVERSITY OF MICHIGAN   (United States)

Author keywords

Adhesion; Conducting polymer; Electroplating; Gold; Impedance

Indexed keywords

ACTUATORS; ADHESION; CONDUCTIVE FILMS; CURRENT DENSITY; ELECTRIC IMPEDANCE; ELECTROCHEMICAL ELECTRODES; ELECTROPLATING; GOLD; MORPHOLOGY; SENSORS; SUBSTRATES;

FUZZY GOLD ELECTRODES;

CONDUCTIVE PLASTICS;

EID: 0037443134     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(02)00427-2     Document Type: Article

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