Improvement of electrical conductivity of Cu/Ag glue joints by discharge cleaning

Vacuum

Volumn 71, Issue 1-2 SPEC., 2003, Pages 207-211

  Cvelbar, Uroš ^a   Mozetič, Miran ^a   Zalar, Anton ^a  

^a Institute of Surface Engineering and Optoelectronics Ljubljana   (Slovenia)

Author keywords

AES; Copper; Discharge cleaning; Electrical conductivity; Glue joint; Hydrogen plasma; Oxygen plasma

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; COPPER; ELECTRIC CONDUCTIVITY; ELECTRIC RESISTANCE; OXYGEN; SILVER;

DISCHARGE CLEANING;

JOINTS (STRUCTURAL COMPONENTS);

EID: 0037427392     PISSN: 0042207X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0042-207X(02)00738-8     Document Type: Conference Paper

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