Microstructure origin of the conductivity differences in aggregated CuS films of different thickness

Langmuir

Volumn 19, Issue 3, 2003, Pages 766-771

  Erokhina, Svetlana ^a,b   Erokhin, Victor ^a,b   Nicolini, Claudio ^a,b   Sbrana, Francesca ^a   Ricci, Davide ^a   Di Zitti, Ermanno ^a  

^a UNIVERSITY OF GENOA   (Italy)

^b Polo Nazionale Bioelettronica   (Italy)

Author keywords

[No Author keywords available]

Indexed keywords

AGGLOMERATION; ATOMIC FORCE MICROSCOPY; ELECTRIC CONDUCTIVITY; INSULATING MATERIALS; LANGMUIR BLODGETT FILMS; MICROSTRUCTURE; THICKNESS MEASUREMENT;

AGGREGATED FILMS; CONDUCTIVITY DIFFERENCES; COPPER SULFIDE; FILM THICKNESS;

COPPER COMPOUNDS;

EID: 0037418069     PISSN: 07437463     EISSN: None     Source Type: Journal    
DOI: 10.1021/la026433s     Document Type: Article

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