Thermal shock behavior of isotropic and anisotropic porous silicon nitride

Journal of the American Ceramic Society

Volumn 86, Issue 4, 2003, Pages 738-40

  She, Jihong ^a   Yang, Jian Feng ^a   Jayaseelan, Daniel Doni ^a   Kondo, Naoki ^a   Ohji, Tatsuki ^a   Kanzaki, Shuzo ^a   Inagaki, Yoshiaki ^b  

^a NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY AIST   (Japan)

^b Fine Ceramics Research Association   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; ELASTIC MODULI; FRACTURE TOUGHNESS; HEAT TRANSFER; MICROSTRUCTURE; POISSON RATIO; QUENCHING; SPECIFIC HEAT; THERMAL CONDUCTIVITY; THERMAL EXPANSION; THERMAL STRESS; X RAY DIFFRACTION ANALYSIS;

THERMAL SHOCK BEHAVIORS;

SILICON NITRIDE;

EID: 0037394381     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.2003.tb03367.x     Document Type: Conference Paper

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