RF inductors and capacitors integrated on silicon chip by CMOS compatible Cu interconnect technology

Microelectronics Reliability

Volumn 43, Issue 3, 2003, Pages 367-370

  Lihui, Guo ^a   Mingbin, Yu ^a   Dow, Foo Pang ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; CMOS INTEGRATED CIRCUITS; DIELECTRIC MATERIALS; ELECTRIC CONDUCTIVITY; ELECTRIC INDUCTORS; INDUCTANCE; MIM DEVICES; Q FACTOR MEASUREMENT;

INTEGRATED CIRCUIT INTERCONNECTS; ON-CHIP CAPACITORS; ON-CHIP INDUCTORS;

MICROPROCESSOR CHIPS;

EID: 0037373453     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2714(02)00344-X     Document Type: Conference Paper

References (7)

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2. Young DJ et al. Monolithic high-performance three-dimensional coil inductors for wireless communication applications. Electron Devices Meeting, 1997. Technical Digest, International Published; 1997. p. 67-70.
3. Saito K et al. A tick-Cu process for add-on interconnections using photosensitive varnish for thick interlayer dielectric. Interconnect Technology Conference, 2000. In: Proceedings of the IEEE 2000. International Published; 2000. p. 123-5.
4. Lopez-Villegas J.M.et al. Improvement of quality factor of RF integrated inductors by layout optimization. IEEE Trans. Microwave Theory Tech. 48(1):2000;76-83.
5. Jiang H.et al. On-chip spiral inductors suspended over deep copper-lined cavities. IEEE Trans. Microwave Theory Tech. 48(12):2000;2415-2423.
6. Burghartz JN. Monolithic spiral inductors fabricated using a VLSI Cu-damascene interconnect technology and low-loss substrates. IEEE International Electron Device Meeting (IEDM'96), 1996. p. 99-102.
7. Pozar D.M. Microwave engineering. 1993;Addison-Wesley Publishing Company. [Chapter 5, Section 5.6].