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Volumn 34, Issue 3, 2003, Pages 169-
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Thermal challenges in next generation electronic systems
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Author keywords
[No Author keywords available]
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Indexed keywords
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EID: 0037370078
PISSN: 00262692
EISSN: None
Source Type: Journal
DOI: 10.1016/S0026-2692(02)00184-2 Document Type: Conference Paper |
Times cited : (10)
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References (0)
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