A mode III crack in functionally graded piezoelectric materials

Mechanics Research Communications

Volumn 30, Issue 2, 2003, Pages 151-159

  Wang, B L ^a,b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Fracture mechanics; Functionally graded materials; Piezoelectric materials; Smart materials

Indexed keywords

ELECTRIC PROPERTIES; FRACTURE MECHANICS; FUNCTIONALLY GRADED MATERIALS; INTEGRAL EQUATIONS; PIEZOELECTRIC MATERIALS; PROBLEM SOLVING; STRESS INTENSITY FACTORS;

MATERIAL INHOMOGENEITY;

CRACK INITIATION;

EID: 0037368908     PISSN: 00936413     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0093-6413(02)00366-X     Document Type: Article

References (4)

1. Erdogan, F., Ozturk, M., 1992. Diffusion problems in bonded nonhomogeneous materials with an interface cut. International Journal of Engineering Science 30, 1507-1523.
2. Erdogan, F., Wu, B.H., 1996. Crack problems in FGM layers under thermal stresses. Journal of Thermal Stresses 19, 237-265.
3. Li, C., Weng, G.J., 2002. Antiplane crack problem in functionally graded piezoelectric materials. ASME Journal of Applied Mechanics 69, 481-488.
4. Wang, B.L., Noda, N., 2001. Thermally induced fracture of a smart functionally graded composite structure. Theoretical and Applied Fracture Mechanics 35, 93-109.