Behavior of oxide film at the interface between particles in sintered Al powders by pulse electric-current sintering

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 34 A, Issue 3, 2003, Pages 699-703

  Xie, Guoqiang ^a   Ohashi, Osamu ^a   Song, Minghui ^b   Furuya, Kazuo ^b   Noda, Tetsuji ^b  

^a NIIGATA UNIVERSITY   (Japan)

^b NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; CHEMICAL BONDS; ELECTRIC CONDUCTIVITY; ELECTRIC CURRENTS; FILMS; MICROSTRUCTURE; OXIDES; PARTICLES (PARTICULATE MATTER); POWDERS; SINTERING; TENSILE STRENGTH; TRANSMISSION ELECTRON MICROSCOPY;

ALUMINUM POWDER; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; OXIDE FILM; PULSE ELECTRIC CURRENT SINTERING;

INTERFACES (MATERIALS);

EID: 0037360670     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-003-0104-2     Document Type: Article

References (25)

1. O. Ohashi, T. Yoshioka, I. Nitta, H. Hasegawa, and S. Sugii: J. Jpn. Inst. Met., 1999, vol. 63, pp. 983-88.
2. H. Kim, M. Kawahara, and M. Tokita: J. Jpn. Soc. Powder Metall., 2000, vol. 47, pp. 887-91.
3. G. Xie, O. Ohashi, T. Yoshioka, M. Song, K. Mitsuishi, H. Yasuda, K. Furuya, and T. Noda: Mater. Trans., 2001, vol. 42, pp. 1846-49.
4. T. Murakami, A. Kitahara, Y. Kòga, M. Kawahara, H. Inui, and M. Yamaguchi: Mater. Sci. Eng., 1997, vols. A239-A240, pp. 672-79.
5. L.L. Ye, Z.G. Liu, K. Raviprasad, M.X. Quan, M. Umemoto, and Z.Q. Hu: Mater. Sci. Eng., 1998, vol. A241, pp. 290-93.
6. Z.G. Liu, M. Umemoto, S. Hirosawa, and H. Kanekiyo: J. Mater. Res., 1999, vol. 14, pp. 2540-47.
7. S.H. Risbud, J.R. Groza, and M.J. Kim: Phil. Mag., 1994, vol. B69, pp. 525-33.
8. M. Yoshimura, T. Ohji, M. Sando, and K. Niihara: J. Mater. Sci. Lett., 1998, vol. 17, pp. 1389-91.
9. S.W. Wang, L.D. Chen, and T. Hirai: J. Mater. Res., 2000, vol. 15, pp. 982-87.
10. M. Omori, T. Kakita, A. Okubo, and T. Hirai: Mater. Sci. Forum. 1999, vols. 308-311, pp. 53-58.
11. M. Tokita: Mater. Sci. Forum, 1999, vols. 308-311, pp. 83-88.
12. D.B. Lee, J.H. Park, Y.H. Park, and Y.J. Kim: Mater. Trans. JIM, 1997, vol. 38, pp. 306-11.
13. T. Takeuchi, E. Betouren, M. Tabuchi, H. Kageyama, Y. Kobayashi, A. Coats, F. Morrison, D.C. Sinclair, and A.R. West: J. Mater. Sci., 1999, vol. 34, pp. 917-924.
14. F. Katsuki, T. Tomida, A. Takata, K. Yanagimoto, and S. Matsuda: Mater. Trans. JIM, 2000, vol. 41, pp. 624-27.
15. C.L. Ma, A. Kasama, Y. Tan, H. Tanaka, R. Tanaka, Y. Mishima, and S. Hanada: Mater. Trans. JIM, 2000, vol. 41, pp. 719-26.
16. M. Omori: Mater. Sci. Eng., 2000, vol. A287, pp. 183-88.
17. J.R. Groza, S.H. Risbud, and K. Yamazaki: J. Mater. Res., 1992, vol. 7, pp. 2643-45.
18. O. Ohashi: J. Jpn. Welding Soc., 2000, vol. 69, pp. 465-74.
19. M. Tokita: J. Soc. Powder Technol. Jpn., 1993, vol. 30 pp. 790-804.
20. O. Yanagisawa, H. Kuramoto, K. Matsugi, and T. Hatayama: Proc. NEDO Int. Symp. on Functionally Graded Materials, Tokyo, 1999, pp. 127-33.
21. R.N. Lumley, T.B. Sercombe, and G.B. Schaffer: Metall. Mater. Trans. A, 1999, vol. 30A, pp. 457-63.
22. R.F. Tylecote: The Solid Phase Welding of Metals, Edward Arnold Ltd., London, U.K., 1968, p. 44.
23. K. Nishimoto, K. Saida, and R. Tsuduki: J. Jpn. Inst. Met., 2001, vol. 65, pp. 747-55.
24. A.A. Shirzadi, H. Assadi, and E.R. Wallach: Surf. Interface Anal., 2001, vol. 31, pp. 609-18.
25. T. Enjo, K. Ikeuchi, and H. Fujita: J. Jpn. Inst. Light Met., 1986, vol. 36, pp. 498-506.