Transient electrochemical processes during Cu-Ni deposition

Transactions of the Institute of Metal Finishing

Volumn 81, Issue 2, 2003, Pages 55-58

  Meuleman, W R A ^a   Roy, S ^a  

^a NEWCASTLE UNIVERSITY   (United Kingdom)

Author keywords

Copper nickel alloys; Current transient; Displacement reaction; Electrodeposition; Potential transient

Indexed keywords

COPPER; ELECTROCHEMISTRY; ELECTROLYTES; INTERFACES (MATERIALS); MULTILAYERS; NANOSTRUCTURED MATERIALS;

DISPLACEMENT REACTIONS;

ELECTRODEPOSITION;

EID: 0037355971     PISSN: 00202967     EISSN: None     Source Type: Journal    
DOI: 10.1080/00202967.2003.11871490     Document Type: Article

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