The effects of triple junctions and grain boundaries on hardness and Young's modulus in nanostructured Ni-P

Scripta Materialia

Volumn 48, Issue 6, 2003, Pages 825-830

  Zhou, Y ^a   Erb, U ^a   Aust, K T ^a   Palumbo, G ^b  

^a UNIVERSITY OF TORONTO   (Canada)

^b Integran Technologies Inc   (Canada)

Author keywords

Electroplating; Interfaces; Mechanical properties; Nanocrystalline materials; Nanoindentation

Indexed keywords

ELASTIC MODULI; ELECTROPLATING; GRAIN BOUNDARIES; GRAIN SIZE AND SHAPE; HARDNESS; NANOSTRUCTURED MATERIALS;

TRIPLE JUNCTIONS;

NICKEL COMPOUNDS;

EID: 0037354123     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1359-6462(02)00511-0     Document Type: Article

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