Study of thermal characteristics of bubble-driven heat-transport device

Heat Transfer - Asian Research

Volumn 32, Issue 2, 2003, Pages 167-177

  Nishio, Shigefumi ^a   Nagata, Shin Ichi ^a   Numata, Shohei ^a   Shirakashi, Ryo ^a  

^a INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

Author keywords

Effective thermal conductivity; Heat pipe; Heat transport device; Phase change

Indexed keywords

BUBBLES (IN FLUIDS); COOLING; ETHANOL; GLASS; HEAT PIPES; HEATING;

HEAT-TRANSPORT DEVICES;

HEAT TRANSFER;

BUBBLE; HEAT TRANSFER; PHASE CHANGE; THERMAL ANALYSIS; TUBE ARRAY;

EID: 0037351486     PISSN: 10992871     EISSN: None     Source Type: Journal    
DOI: 10.1002/htj.10082     Document Type: Article

References (6)

1. The National Technology Roadmap for Semiconductors: Technology Needs. SIA; 1997.
2. Peterson GP, Duncan AB, Weichold MH. ASME J Heat Transfer 1993;115:751-756.
3. Mochizuki M. Tech Rep IEICE 1997;CPM97-120, ICD97-180, p 37-41. (in Japanese)
4. Nishio S, Shi X-H, Zhang M-H. Int J Heat Mass Transfer 1995;38:2457-2470.
5. Akachi H. Proc JSME No. 940-10, 1994;3:140-143. (in Japanese)
6. Hosoda M, Nishio S, Shirakashi R. Trans JSME Ser B 1998;64:1845-1851. (in Japanese)