Fracture behavior around a crack tip in rubber-modified epoxy adhesive joint with various bond thickness

Journal of Materials Science Letters

Volumn 22, Issue 3, 2003, Pages 229-233

  Lee, Deok Bo ^a   Ikeda, T ^b   Miyasaki, N ^b   Choi, Nak Sam ^a  

^a Hanyang University   (South Korea)

^b KYUSHU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESIVE JOINTS; ALUMINUM ALLOYS; BUTADIENE; CHEMICAL BONDS; CHEMICAL MODIFICATION; COPOLYMERS; CRACKS; CURING; ETCHING; FRACTURE; PHENOLS;

BISPHENOL; DIGLYCIDYL ETHER; LIQUID COPOLYMER; RUBBER-MODIFIED EPOXY ADHESIVE JOINT; VACUUM CONTAINER;

EPOXY RESINS;

EID: 0037296264     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1022218530150     Document Type: Article

References (10)

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