Development of a polishing disc containing granulated fine abrasives

Key Engineering Materials

Volumn 238-239, Issue , 2003, Pages 257-262

  Nakamura, H ^a   Yan, J ^b   Syoji, K ^c   Wakamatsu, Y ^a  

^a HACHINOHE NATIONAL COLLEGE OF TECHNOLOGY   (Japan)

^b KITAMI INSTITUTE OF TECHNOLOGY   (Japan)

^c TOHOKU UNIVERSITY   (Japan)

Author keywords

Fixed abrasive; Granulated fine abrasive; Polishing; Polishing disc; Silicon wafer

Indexed keywords

ABRASIVES; ADDITION REACTIONS; BRITTLENESS; DENSITY (SPECIFIC GRAVITY); DRYING; GRANULAR MATERIALS; GRANULATION; SCANNING ELECTRON MICROSCOPY; SILICON WAFERS; SODIUM COMPOUNDS; SURFACE PROPERTIES; VICKERS HARDNESS TESTING;

ABRASIVE GRAINS; GRANULATED FINE ABRASIVES; POLISHING DISC; SODIUM ALGINATE;

CHEMICAL POLISHING;

EID: 0037285388     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/kem.238-239.257     Document Type: Article

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