Material removal mechanism in dynamic friction polishing of diamond

Key Engineering Materials

Volumn 238-239, Issue , 2003, Pages 235-240

  Suzuki, Kiyoshi ^a   Iwai, Manabu ^b   Uematsu, Tetsutaro ^b   Yasunaga, Nobuo ^c  

^a NIPPON INSTITUTE OF TECHNOLOGY   (Japan)

^b TOYAMA PREFECTURAL UNIVERSITY   (Japan)

^c TOKAI UNIVERSITY   (Japan)

Author keywords

Abrasive free polishing; Diamond; Dynamic friction polishing method; Polishing of diamond; SUS304; Thermochemical reaction

Indexed keywords

CARBON; CHEMICAL POLISHING; DIFFUSION; POLYCRYSTALLINE MATERIALS; PRESSING (FORMING); REACTION KINETICS; REMOVAL; SINGLE CRYSTALS; STAINLESS STEEL; SURFACE PHENOMENA; X RAY DIFFRACTION ANALYSIS;

DYNAMIC FRICTION POLISHING; POLISHING EFFICIENCY; REMOVAL MECHANISM; THERMOCHEMICAL REACTION;

DIAMONDS;

EID: 0037282790     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/kem.238-239.235     Document Type: Article

References (6)

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