High-Q RF inductors on 20 Ω.cm silicon realized through wafer-level packaging techniques

Microelectronics International

Volumn 20, Issue 1, 2003, Pages 26-30+7+10

  Carchon, G J ^a   De Raedt, W ^a   Beyne, E ^a  

^a IMEC   (Belgium)

Author keywords

Electronic packaging; Interconnection; Multilayers

Indexed keywords

EID: 0037277046     PISSN: 13565362     EISSN: None     Source Type: Journal    
DOI: 10.1108/13565360310455490     Document Type: Article

References (17)