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Volumn 11, Issue 3, 2003, Pages 197-212

Synthesis and properties of amide-containing bisnadimide copper foil composites

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL RESISTANCE; COPPER; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HEAT RESISTANCE; METAL FOIL; PERMITTIVITY; PRINTED CIRCUIT BOARDS; RESINS; SCANNING ELECTRON MICROSCOPY; STRUCTURE (COMPOSITION); SYNTHESIS (CHEMICAL); THERMOGRAVIMETRIC ANALYSIS; X RAY ANALYSIS;

EID: 0037262047     PISSN: 09673911     EISSN: None     Source Type: Journal    
DOI: 10.1177/096739110301100305     Document Type: Article
Times cited : (3)

References (13)
  • 5
    • 0013040802 scopus 로고
    • Hsu Foundation, Taipei, Taiwan
    • Chang C. C., " Plastics Guide Book ", Hsu Foundation, Taipei, Taiwan, (1991) 407
    • (1991) Plastics Guide Book , pp. 407
    • Chang, C.C.1
  • 11
    • 0031651758 scopus 로고    scopus 로고
    • Effect of curing temperature on the adhesion strength of polyamideimide/copper joints
    • Cho J. H., Kong D. I., Park C. E. Jin M. Y.," Effect of curing temperature on the adhesion strength of polyamideimide / copper joints ", Journal of Adhesion Science and Technology, 12, (5), (1998) 507
    • (1998) Journal of Adhesion Science and Technology , vol.12 , Issue.5 , pp. 507
    • Cho, J.H.1    Kong, D.I.2    Park, C.E.3    Jin, M.Y.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.