A study of polyamide-imide resin/copper foil composite materials

Polymers and Polymer Composites

Volumn 11, Issue 1, 2003, Pages 57-67

  Chou, Shen ^a   Lee, Ker Sen ^a  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; FOURIER TRANSFORM INFRARED SPECTROSCOPY; HEAT RESISTANCE; LAMINATES; MONOMERS; PERMITTIVITY; POLYAMIDEIMIDES; RESINS;

AMINOBENZOIC ACID; DISSIPATION FACTOR; NORBORNENE DICARBOXYLIC ANHYDRIDE; OXYDIANILINE;

COMPOSITE MATERIALS;

EID: 0037253882     PISSN: 09673911     EISSN: None     Source Type: Journal    
DOI: 10.1177/096739110301100107     Document Type: Article

References (13)

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