Microelectronics packaging and integration

MRS Bulletin

Volumn 28, Issue 1, 2003, Pages 11-15

  Reuss, Robert H ^a   Chalamala, Babu R ^b  

^a DEFENSE ADVANCED RESEARCH PROJECTS AGENCY   (United States)

^b MCNC   (United States)

Author keywords

Microelectronic materials; Microelectronics packaging and integration; Technology roadmaps

Indexed keywords

CMOS INTEGRATED CIRCUITS; INTEGRATED CIRCUIT MANUFACTURE; MATERIALS SCIENCE; MICROELECTRONICS; MICROPROCESSOR CHIPS; TECHNOLOGICAL FORECASTING;

MICROELECTRONICS PACKAGING; PACKAGE DESIGN; TECHNOLOGY ROADMAPS;

ELECTRONICS PACKAGING;

EID: 0037249598     PISSN: 08837694     EISSN: None     Source Type: Journal    
DOI: 10.1557/mrs2003.13     Document Type: Article

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