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Volumn 199, Issue , 2003, Pages 469-474

Electromigration in integrated circuit interconnects studied by X-ray microscopy

Author keywords

Electromigration; Interconnects; X ray imaging; Zone plates

Indexed keywords

CURRENT DENSITY; DIELECTRIC DEVICES; ELECTROMIGRATION; MULTILAYERS; PHOTONS; X RAY MICROSCOPES;

EID: 0037244304     PISSN: 0168583X     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0168-583X(02)01565-3     Document Type: Conference Paper
Times cited : (6)

References (10)
  • 10
    • 0004077698 scopus 로고    scopus 로고
    • ASTM standard F 1259M-96, American Society for Testing and Materials
    • ASTM standard F 1259M-96, Annual book of ASTM standards, American Society for Testing and Materials, 1996.
    • (1996) Annual Book of ASTM Standards


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.