A novel process for the manufacturing of advanced interconnects

Circuit World

Volumn 29, Issue 3, 2003, Pages 18-21

  Mosses, R ^a   Brackenridge, S ^a  

^a Rosebank Industrial Park   (United Kingdom)

Author keywords

Electronics industry; Manufacturing; New technology

Indexed keywords

ELECTRONICS PACKAGING; INTERCONNECTION NETWORKS; LASER ABLATION; PHOTORESISTS;

CONDUCTIVE PASTES; HIGH DENSITY INTERCONNECT;

PRINTED CIRCUIT MANUFACTURE;

EID: 0037241354     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120310460775     Document Type: Article

References (0)