Multichip packaging business and logistical issues

Advanced Packaging

Volumn 12, Issue 1, 2003, Pages 29-31

  Bauer, Charles E ^a   Riley, John ^b  

^a TechLead Corp   (United States)

^b Tessera Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONSUMER ELECTRONICS; INTEGRATED CIRCUIT MANUFACTURE; MICROELECTRONICS; MULTICHIP MODULES; PRINTED CIRCUIT BOARDS;

MULTIPLE CHIP PACKAGES (MCP);

ELECTRONICS PACKAGING;

EID: 0037241276     PISSN: 10650555     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (0)