The influence of thermal conductivity on segmented chip formation

Computational Materials Science

Volumn 26, Issue SUPPL., 2003, Pages 175-182

  Bäker, Martin ^a   Rösler, Joachim ^a   Siemers, Carsten ^a  

^a TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

Author keywords

Finite elements; Machining; Remeshing; Segmented chips; Thermal conductivity

Indexed keywords

COMPUTER SIMULATION; CUTTING; DEFORMATION; FINITE ELEMENT METHOD; MILLING (MACHINING); THERMAL CONDUCTIVITY;

SEGMENTED CHIPS;

TITANIUM ALLOYS;

EID: 0037240924     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0927-0256(02)00396-8     Document Type: Conference Paper

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