Thermal stress around a penny-shaped crack in a thermopiezoelectric solid

Computational Materials Science

Volumn 26, Issue SUPPL., 2003, Pages 197-201

  Shang, Fulin ^a   Kuna, Meinhard ^b  

^a XI AN THERMAL POWER RESEARCH INSTITUTE CO   (China)

^b TU BERGAKADEMIE FREIBERG   (Germany)

Author keywords

Analytical solution; FE method; Penny shaped crack; Thermopiezoelectricity

Indexed keywords

COMPUTER SIMULATION; CONTINUUM MECHANICS; EQUATIONS OF MOTION; FINITE ELEMENT METHOD; FRACTURE; PIEZOELECTRICITY;

THERMOPIEZOELECTRICITY;

PIEZOELECTRIC MATERIALS;

EID: 0037238702     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0927-0256(02)00399-3     Document Type: Conference Paper

References (7)

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2. Qin Q.-H. Fracture Mechanics of Piezoelectric Materials. 2001;WIT Press Southampton, Boston.
3. Chen W.Q., Shioya T. Fundamental solution for a penny-shaped crack in a piezoelectric medium. J. Mech. Phys. Solids. 47:1999;1459-1475.
4. Kuna M. Finite element analyses of crack problems in piezoelectric structures. Comput. Mat. Sci. 13:1998;67-80.
5. Shang F., Kuna M., Abendroth M. Finite element analyses of 3D crack problems in piezoelectric structures. Eng. Fract. Mech. 70:2003;143-160.
6. F. Shang, M. Kuna, M. Scherzer, Development of FE techniques for 3D analysis of thermopiezoelectric materials, in: Euromech Colloquium 429, Sep. 2001, Vienna, Austria.
7. F. Shang, M. Kuna, M. Scherzer, Analytical solutions for two penny-shaped crack problems in thermopiezoelectric materials and their finite element comparisons, Int. J. Fract., submitted for publication.