Adhesive elements for stress analysis of bonded patch to curved thin-walled structures

Computational Mechanics

Volumn 30, Issue 2, 2003, Pages 143-154

  Tong, L ^a   Sun, X ^a  

^a UNIVERSITY OF SYDNEY   (Australia)

Author keywords

Bonded patch; Curvature; Finite element analysis; Stress analysis; Thin walled structures

Indexed keywords

ADHESIVES; ALUMINUM; BONDING; COMPOSITE MATERIALS; CRACKS; DATABASE SYSTEMS; FINITE ELEMENT METHOD; NUMERICAL ANALYSIS; STRESS ANALYSIS;

ADHESIVE ELEMENTS;

THIN WALLED STRUCTURES;

EID: 0037223468     PISSN: 01787675     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00466-002-0374-3     Document Type: Article

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