Role of cell surface components on Cu2+ adsorption by Pseudomonas putida 5-x isolated from electroplating effluent

Water Research

Volumn 37, Issue 3, 2003, Pages 561-568

  Wang, L ^a   Chua, H ^a   Zhou, Q ^b   Wong, P K ^c   Sin, S N ^a   Lo, W L ^d   Yu, P H ^d  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^b TONGJI UNIVERSITY   (China)

^c CHINESE UNIVERSITY OF HONG KONG   (Hong Kong)

^d UNIVERSITY OF HONG KONG   (Hong Kong)

Author keywords

Adsorption isotherm; Cell capsule; Cell envelopes; Cu2+ adsorption capacity; Peptidoglycan layer (PEG); Pseudomonas putida

Indexed keywords

ADSORPTION; BACTERIA; COPPER; DEGRADATION; EFFLUENTS; ELECTROPLATING; HYDROCHLORIC ACID; INDUSTRIAL PLANTS;

SURFACE COMPONENTS;

WATER TREATMENT;

COPPER ION; HYDROCHLORIC ACID; PEPTIDOGLYCAN;

ADSORPTION; EFFLUENT TREATMENT; ELECTROPLATING; WASTEWATER;

ADSORPTION; ARTICLE; BACTERIAL MEMBRANE; BACTERIUM ISOLATION; BIODEGRADATION; CELL SURFACE; CONTROLLED STUDY; EFFLUENT; ELECTROPLATING INDUSTRY; HEAVY METAL REMOVAL; HONG KONG; ISOTHERM; NONHUMAN; OUTER MEMBRANE; PRIORITY JOURNAL; PSEUDOMONAS PUTIDA;

BACTERIA (MICROORGANISMS); NEGIBACTERIA; PSEUDOMONAS; PSEUDOMONAS PUTIDA;

EID: 0037211789     PISSN: 00431354     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0043-1354(02)00350-0     Document Type: Article

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