Structure properties of Cu-Ni alloys at the rapid cooling rate using embedded-atom method

Materials Science and Engineering: A

Volumn 326, Issue 2, 2002, Pages 343-347

  Cong, Hong Ri ^a   Bian, Xiu Fang ^a   Zhang, Jing Xiang ^a   Li, Hui ^b  

^a SHANDONG UNIVERSITY   (China)

^b NANJING UNIVERSITY   (China)

Author keywords

EAM potential; Molecular dynamics; Rapid solidification

Indexed keywords

AMORPHOUS ALLOYS; COMPOSITION EFFECTS; COMPUTER SIMULATION; COOLING; CRYSTAL STRUCTURE; DIFFUSION; MOLECULAR DYNAMICS; RAPID SOLIDIFICATION;

AMORPHOUS STRUCTURE; EMBEDDED-ATOM METHODS;

COPPER ALLOYS;

MOLECULAR STRUCTURE;

EID: 0037204451     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0921-5093(01)01527-1     Document Type: Article

References (13)