Thermal analysis of curing process of epoxy prepreg

Journal of Applied Polymer Science

Volumn 83, Issue 5, 2002, Pages 1074-1083

  Sun, Liangfeng ^a   Pang, Su Seng ^a   Sterling, Arthur M ^a   Negulescu, Ioan I ^a   Stubblefield, Michael A ^b  

^a LOUISIANA STATE UNIVERSITY   (United States)

^b SOUTHERN UNIVERSITY   (United States)

Author keywords

Autocatalytic model; Cure kinetics; DSC; Epoxy prepreg

Indexed keywords

CATALYSIS; COMPUTER SIMULATION; CURING; DIFFERENTIAL SCANNING CALORIMETRY; DIFFUSION; MATHEMATICAL MODELS; REACTION KINETICS; THERMAL EFFECTS; THERMAL VARIABLES MEASUREMENT; THERMOANALYSIS; THERMOSETS;

AUTOCATALYTIC MODEL; DIFFUSION FACTOR; EPOXY PREPREG; HEAT OF THE ISOTHERMAL CURE REACTION; ISOTHERMAL MEASUREMENTS;

EPOXY RESINS;

CURING; EPOXY RESIN; PREPREG; THERMAL ANALYSIS;

EID: 0037203642     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/app.10053     Document Type: Article

References (16)