Silicon glass anodic bonding under partial vacuum conditions: Problems and solutions

Sensors and Actuators, A: Physical

Volumn 101, Issue 1-2, 2002, Pages 156-159

  Blasquez, Gabriel ^a   Favaro, Patrick ^a  

^a LAAS CNRS   (France)

Author keywords

Anodic bonding; Electrostatic bonding; MEMS technology; Silicon glass bonding; Vacuum sealing

Indexed keywords

ALUMINUM; BONDING; GLASS; MICROELECTROMECHANICAL DEVICES; SILICON WAFERS; VACUUM APPLICATIONS;

ANODIC BONDING; ELECTROSTATIC BONDING; VACUUM SEALING;

SENSORS;

EID: 0037201886     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(02)00196-6     Document Type: Article

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