Generalized fracture mechanical integral concept JG and application in microelectronic packaging technology

Sensors and Actuators, A: Physical

Volumn 99, Issue 1-2, 2002, Pages 183-187

  Ghavifekr, H B ^a   Michel, B ^a  

^a FRAUNHOFER IZM   (Germany)

Author keywords

Ball grid array; Fracture mechanics; Thermal cycling

Indexed keywords

CRACK PROPAGATION; ELECTRONICS PACKAGING; EUTECTICS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FRACTURE MECHANICS; INTEGRAL EQUATIONS; INTERFACES (MATERIALS); SOLDERING ALLOYS; THERMAL CYCLING;

BALL GRID ARRAYS;

MICROELECTRONICS;

EID: 0037197331     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00878-0     Document Type: Conference Paper

References (8)

1. A path independent integral and the approximate analysis of strain concentration by notches and cracks
2. On the energy release rate and the J-integral for 3-D crack configurations
3. Energy release rate calculations by the finite element method
4. Usage of fracture mechanical integral concept T* in microelectronic packaging technique
5. Fully-plastic crack problems: The center cracked strip under plane strain
6. A fracture mechanics approach to creep crack growth
7. On the path independent integral J
8. Path independent integrals in finite elasticity and inelasticity, with body forces, inertia, and arbitrary crack-face conditions