Fracture mechanics of bonding interface: A cohesive zone model

Sensors and Actuators, A: Physical

Volumn 99, Issue 1-2, 2002, Pages 198-206

  Kishimoto, K ^a,c   Omiya, M ^a   Yang, W ^b  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

^b TSINGHUA UNIVERSITY   (China)

^c Tel: +81 3 5734 2501 ^*  (Japan)

Author keywords

Cohesive force model; Fracture criterion; Fracture toughness; Interface crack; Stress intensity factor

Indexed keywords

COHESIVE FORCE;

BONDING; CRACK PROPAGATION; DISSIMILAR MATERIALS; FINITE ELEMENT METHOD; FRACTURE MECHANICS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; PLASTIC DEFORMATION; SHEAR STRESS; STRESS INTENSITY FACTORS;

MICROELECTRONICS;

EID: 0037197311     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(01)00884-6     Document Type: Conference Paper

References (10)