Synergistic effects of organic additives on the discharge, nucleation and growth mechanisms of tin at polycrystalline copper electrodes

Journal of Electroanalytical Chemistry

Volumn 537, Issue 1-2, 2002, Pages 151-163

  Barry, Fergal J ^a,b   Cunnane, V J ^a  

^a UNIVERSITY OF LIMERICK   (Ireland)

^b Athletic Rehabilitation Therapy Ireland   (Ireland)

Author keywords

Electrodeposition; Growth mechanisms; Nucleation; Organic additives; Tin

Indexed keywords

ADDITIVES; COPPER; CURRENT DENSITY; ELECTRODEPOSITION; ELECTRODES; ELECTROLYTES; INTERFACES (MATERIALS); NUCLEATION; ORGANIC COMPOUNDS; POLYCRYSTALLINE MATERIALS; RATE CONSTANTS;

ORGANIC ADDITIVES;

TIN;

EID: 0037195444     PISSN: 00220728     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0022-0728(02)01266-4     Document Type: Article

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