An analytical estimate of thermal effects in a composite bonded repair: Plane stress analysis

International Journal of Solids and Structures

Volumn 39, Issue 4, 2002, Pages 1003-1014

  Duong, C N ^a   Yu, J ^a  

^a BOEING COMPANY   (United States)

Author keywords

Composite bonded repair; Stress intensity factor; Thermal stresses

Indexed keywords

CHEMICAL BONDS; CRACKS; CURING; ELASTICITY; INCLUSIONS; THERMAL EFFECTS; THERMAL EXPANSION; THERMAL STRESS;

COMPOSITE BONDED PAIRS; DISPLACEMENT COMPATABILITY;

ADHESIVES;

COMPOSITE;

EID: 0037170309     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0020-7683(01)00239-6     Document Type: Article

References (12)

1. The elastic field of an elliptic cylindrical inclusion in a laminate with multiple isotropic layers
2. Time- or cycle dependent crack bridging
3. An approximate algorithmic solution for the elastic fields in bonded patched sheets
4. The stress intensity factor for a cracked stiffened sheet repaired with an adhesively bonded composite patch
5. A nonlinear thermoviscoelastic stress and fracture analysis of an adhesive bond
6. A sandwich plate with a part-through and a debonding crack
7. Eshelby's inclusion problem for polygons and polyhedra
8. An application of the inclusion analogy
9. Theoretical analysis of crack patching
10. Thermal stresses in a plate with a circular reinforcement
11. A crack bridging model for bonded plates subjected to tension and bending