Improvement in the adhesion of polyimide/epoxy joints using various curing agents

Journal of Applied Polymer Science

Volumn 86, Issue 4, 2002, Pages 812-820

  Kim, Seong Hun ^a   Lee, Dong Woo ^a   Chung, Kyung Ho ^b   Park, Jae Ki ^c   Jaung, Jae Yun ^a   Jeong, Sung Hoon ^a  

^a Hanyang University   (South Korea)

^b Suwon University   (South Korea)

^c Korea Institute of Industrial Technology   (South Korea)

Author keywords

Adhesion; Epoxy adhesive; Polyamic acid; Polyimide; Surface modification

Indexed keywords

ADHESION; CHEMICAL BONDS; CONTACT ANGLE; CURING; EPOXY RESINS; FOURIER TRANSFORM INFRARED SPECTROSCOPY; INTERFACIAL ENERGY; MECHANICAL PROPERTIES; SCANNING ELECTRON MICROSCOPY; SPIN COATING; SURFACE TREATMENT; X RAY PHOTOELECTRON SPECTROSCOPY;

FUNCTIONAL GROUP; INTERMOLECULAR FORCES; PEEL STRENGTH; POLYAMIC ACID;

POLYIMIDES;

ADHESION; CURING; EPOXY RESIN;

EID: 0037167957     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/app.10771     Document Type: Article

References (12)