Die products: Ideal IC packaging for demanding applications

Electronic Design

Volumn 50, Issue 27, 2002, Pages 47-50

  Gilg, Larry ^b   Windsor, Chris ^a  

^a Portelligent   (United States)

^b NONE

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0037164931     PISSN: 00134872     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (4)

1. Windsor, Chris, "Die Products Applications," Proceedings of the 9th Annual KGD Packaging and Test Workshop, Sept. 2002, Napa, Calif.
2. Emerging IC Markets, 2002 Edition. IC Insights Inc. 13901 N. 73rd St., Ste. 205, Scottsdale, Ariz. 85260.
3. i b i d.
4. Aguirre, Mario, Fujitsu Microelectronics America, "Super High Density Packaging Technologies," presentation at the 9th Annual KGD Packaging and Test Workshop, Sept. 2002, Napa, Calif.