A study on micro-grooving characteristics of planar lightwave circuit and glass using ultrasonic vibration cutting

Journal of Materials Processing Technology

Volumn 130-131, Issue , 2002, Pages 396-400

  Lee, Jun Seok ^a   Lee, Deug Woo ^a   Jung, Yoong Ho ^a   Chung, Woo Seop ^b  

^a Pusan National University   (South Korea)

^b Techmac Ltd   (South Korea)

Author keywords

Glass; Micro grooving; Planar lightwave circuit; Ultrasonic vibration cutting

Indexed keywords

BRITTLENESS; DIAMOND CUTTING TOOLS; GLASS; MACHINING; NETWORKS (CIRCUITS); OPTICAL COMMUNICATION; POLYCRYSTALLINE MATERIALS;

MICRO-GROOVING;

ULTRASONIC CUTTING;

EID: 0037146960     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(02)00740-9     Document Type: Conference Paper

References (6)

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3. J. Kumabe, Fundamentals and Application of Vibration Cutting, Jikkyou Publishing Company, Tokyo, Japan, 1979.
4. Shamoto E., Moriwaki T., Inoue K. Ultraprecision ductile cutting of glass by applying ultrasonic vibration. Ann. CIRP. 41(1):1992;141-144.
5. J.P. Kang, A study on ultrasonic vibration cutting of fine ceramics, Ph.D. Thesis, Pusan National University, 1993.
6. Shamoto E., Moriwaki T. Study on elliptical vibration cutting. Ann. CIRP. 43(1):1994;31-34.