On the porosity of TiN films deposited by HCD ion plating

Surface and Coatings Technology

Volumn 155, Issue 2-3, 2002, Pages 239-244

  Chen, Y M ^a,b   Yu, G P ^a   Huang, J H ^a  

^a NATIONAL TSING HUA UNIVERSITY   (Taiwan)

^b INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE   (Taiwan)

Author keywords

Grain size; Hollow cathode discharge; Porosity; Texture; Titanium nitride

Indexed keywords

ION PLATING;

CHEMICAL VAPOR DEPOSITION; GRAIN SIZE AND SHAPE; ION BOMBARDMENT; METALLIC FILMS; PHYSICAL VAPOR DEPOSITION; PLATING; POROSITY; SURFACE PHENOMENA;

TITANIUM NITRIDE;

COATING; CORROSION; POROSITY; TITANIUM NITRIDE;

EID: 0037124996     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0257-8972(02)00049-X     Document Type: Article

References (17)