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Volumn 195, Issue 1-4, 2002, Pages 155-165
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Formalin solution and acetone as organic additives in electrodeposition of copper
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Author keywords
Acetone; Copper; EDX; Electrodeposition; Formalin; Physicochemical properties; Thermodynamic parameters
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Indexed keywords
ACETONE;
ADDITIVES;
CATHODES;
COPPER;
CURRENT DENSITY;
FORMALDEHYDE;
MASS TRANSFER;
PERMITTIVITY;
SOLVENTS;
VISCOSITY;
X RAY ANALYSIS;
ORGANIC ADDITIVES;
ELECTRODEPOSITION;
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EID: 0037099338
PISSN: 01694332
EISSN: None
Source Type: Journal
DOI: 10.1016/S0169-4332(02)00553-6 Document Type: Article |
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Times cited : (16)
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References (30)
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