Thermal stability investigations on laminated antiferromagnetically coupled media

Journal of Applied Physics

Volumn 91, Issue 10 I, 2002, Pages 8620-8622

  Pang, S I ^a   Piramanayagam, S N ^a   Wang, J P ^a  

^a DATA STORAGE INSTITUTE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ANTIFERRO-MAGNETICALLY COUPLED; ANTIFERROMAGNETIC COUPLING; ANTIFERROMAGNETICALLY COUPLED MEDIA; BOTTOM LAYERS; DIFFERENT TIME SCALE; STABILITY FACTOR; TIME-SCALES;

LAMINATING;

THERMODYNAMIC STABILITY;

EID: 0037094990     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1453346     Document Type: Article

References (11)

1. 2 was demonstrated by Fujitsu.
2. E. N. Abarra, I. Okamoto, and M. Shinohara, IEEE Trans. Magn. 35, 2709 (1999). emg IEMGAQ 0018-9464
3. S. N. Piramanayagam, J. P. Wang, Z. S. Shan, W. C. Ye, and T. C. Chong, IEEE Trans. Magn. 37, 1950 (2001). emg IEMGAQ 0018-9464
4. T. Pan and G. W. Spratt, IEEE Trans. Magn. 32, 3623 (1996); emg IEMGAQ 0018-9464
5. M. Alex and D. Wachenschwanz, 35, 2796 (1999); emg IEMGAQ 0018-9464
6. H. J. Richter, S. Z. Wu, and R. Malmhall, 34, 1606 (1998). emg IEMGAQ 0018-9464
7. S. N. Piramanayagam, C. H. Hee, and J. P. Wang, J. Appl. Phys. 90, 3442 (2001). jap JAPIAU 0021-8979
8. S. I. Pang, S. N. Piramanayagam, and J. P. Wang, Appl. Phys. Lett. 80, 616 (2002).
9. M. P. Sharrock, IEEE Trans. Magn. 26, 193 (1990). emg IEMGAQ 0018-9464
10. Modified Sharrock's equation by Z. S. Shan et al. (private communication).
11. S. N. Piramanayagam, J. P. Wang, Z. S. Shan, S. I. Pang, X. Shi, C. K. Pock, and T. C. Chong, IEEE Trans. Magn. 37, 1438 (2001). emg IEMGAQ 0018-9464