Factors affecting surface roughness and coercivity of Ni 80Fe 20 thin films

Journal of Applied Physics

Volumn 91, Issue 10 I, 2002, Pages 7206-7208

  Ng, V ^a   Hu, J F ^a,b   Adeyeye, A O ^a   Wang, J P ^b   Chong, T C ^b  

^a NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

^b DATA STORAGE INSTITUTE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

DC POWER; MAGNETIC TUNNELING JUNCTIONS; OPTIMUM VALUE; RF BIAS; SI (100) SUBSTRATE; SUBSTRATE BIAS; THICKNESS DEPENDENCE; THIN FILMS-SPUTTERED;

COERCIVE FORCE; DC POWER TRANSMISSION; DEPOSITION; SILICON; SURFACE ROUGHNESS; THIN FILMS; VAPOR DEPOSITION;

SUBSTRATES;

EID: 0037094515     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1450841     Document Type: Article

References (5)

1. J. S. Moodera, J. Nowak, and R. J. M. Van de Veerdonk, Phys. Rev. Lett. 80, 2941 (1998). prl PRLTAO 0031-9007
2. J. S. Moodera and L. R. Kinder, J. Appl. Phys. 79, 4724 (1996). jap JAPIAU 0021-8979
3. G. Choe, A. Tsoukatos, and S. Gupta, IEEE Trans. Magn. 34, 867 (1998). emg IEMGAQ 0018-9464
4. G. Choe and M. Steinback, J. Appl. Phys. 85, 5777 (1999). jap JAPIAU 0021-8979
5. K.-H. Müller, J. Vac. Sci. Technol. A 4, 184 (1986). jva JVTAD6 0734-2101