A comparison of microstrip models to low temperature co-fired ceramic-silver microstrip measurements

Microelectronics Journal

Volumn 33, Issue 5-6, 2002, Pages 443-447

  Shapiro, Andrew A ^a   Mecartney, Martha L ^a   Lee, Henry P ^b  

^a University of California at Irvine   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

High frequency; Interconnects; Low temperature cofired ceramic; Packaging

Indexed keywords

AMORPHOUS MATERIALS; CERAMIC MATERIALS; DIELECTRIC LOSSES; ELECTRONICS PACKAGING; LOW TEMPERATURE EFFECTS; MICROSTRUCTURE; SILICA;

LOW TEMPERATURE CO-FIRED CERAMICS (LTCC);

MICROSTRIP LINES;

EID: 0037029754     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(02)00002-2     Document Type: Article

References (15)

1. Transmission-line properties of parallel strips separated by a dielectric sheet
2. Transmission line properties of a strip on a dielectric sheet on a plane
3. Losses in microstrip
4. Accurate models for microstrip computer aided design
5. Simple and accurate formulas for a microstrip with finite strip thickness
6. 2 low temperature cofired ceramic for microelectronic packaging
7. Simplified theory of microstrip transmission system
8. Dielectric loss in integrated microwave circuits