Nanostructured dendrimer-based networks with hydrophilic polyamidoamine and hydrophobic organosilicon domains

Macromolecules

Volumn 35, Issue 25, 2002, Pages 9323-9333

  Dvornic, Petar R ^a   Li, Jieming ^a   De Leuze Jallouli, Agnes M ^a   Reeves, Scott D ^a   Owen, Michael J ^a  

^a MICHIGAN MOLECULAR INSTITUTE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CONTACT ANGLE MEASUREMENT; HYDROPHOBIC ORGANOSILICON DOMAINS; POLYAMINDOAMINE; SILANOL CONDENSATION REACTION; SOL-GEL TYPE HYDROLYSIS;

AMINES; ATOMIC FORCE MICROSCOPY; CHEMISTRY; CROSSLINKING; CURING; ENERGY DISPERSIVE SPECTROSCOPY; GLASS TRANSITION; NANOSTRUCTURED MATERIALS; POLYCONDENSATION; SCANNING ELECTRON MICROSCOPY; SILICON COMPOUNDS; X RAY PHOTOELECTRON SPECTROSCOPY;

INTERPENETRATING POLYMER NETWORKS;

EID: 0037016115     PISSN: 00249297     EISSN: None     Source Type: Journal    
DOI: 10.1021/ma020649j     Document Type: Article

References (48)

1. (a) Newkome, G. R.; Moorefield, C. N.; Vögtle, F. Dendrimers and Dendrons. Concepts, Synthesis, Applications; Wiley-VCH Verlag: Weinheim, Germany, 2001.
2. (b) Crooks, R. M.; Lemon, B. I.; Sun, L.; Yeung, L. K.; Zhao, M. Q. Top. Curr. Chem. 2001, 212, 81.
3. (c) Froehling, P. E. Dyes Pigments 2001, 48, 187.
4. (d) Gorman, C. B.; Smith, J. C. Acc. Chem. Res. 2001, 34, 60.
5. (e) Baars, M. W. P. L.; Meijer, E. W. Top. Curr. Chem. 2000, 210, 131.
6. (f) Archut, A.; Vögtle, F. In Handbook of Nanostructured Materials and Nanotechnology; Nalwa, N. S., Ed.; Academic Press: New York, 2000; Vol. 5, pp 333-374.
7. (g) Fischer, M.; Vögtle, F. Angew. Chem., Int. Ed. 1999, 38, 884.
8. (h) Majoral, J.-P.; Caminade, A. M. Chem. Rev. 1999, 99, 884.
9. (i) Archut, A.; Issberner, J.; Vögtle, F. In Organic Synthesis Highlights III; Mulzer, J., Waldman, H., Eds.; Wiley-VCH: Weinheim, 1998; p 391.
10. (j) Frey, H.; Lach, C.; Lorenz, K. Adv. Mater. 1998, 10, 279.
11. (k) Zeng, F.; Zimmerman, S. C. Chem. Rev. 1997, 97, 1681.
12. (l) Newkome, G. R.; Moorefield, C. N.; Vögtle, F. Dendritic Molecules: Concepts, Synthesis, Perspectives; VCH Verlagsgesellschaft: Weinheim, Germany, 1998.
13. (m) Dvornic, P. R.; Tomalia, D. A. Curr. Opin. Colloid Interface Sci. 1996, 1, 221.
14. (n) Dvornic, P. R.; Tomalia, D. A. In The Polymeric Materials Encyclopedia; Salamone, J. C., Ed.; CRC Press: Boca Raton, FL, 1996; Vol. 3, p 1814.
15. (o) Voit, B. I. Acta Polym. 1995, 46, 87.
16. (p) Ardoin, N.; Astruc, D. Bull. Soc. Chim. Fr. 1995, 132, 875.
17. (q) Hawker, C. J.; Fréchet, J. M.-J. In New Methods of Polymer Synthesis; Ehdon, J. R., Eastmond, G. C., Eds.; Blackie Academic and Professional: Glasgow, 1995; Vol. 2, p 290.
18. Dvornic, P. R.; de Leuze-Jallouli, A. M.; Owen, M. J.; Perz, S. V. In Silicones and Silicone-Modified Materials; Clarson, S. J., Fitzgerald, J. J., Owen, M. J., Eds.;
19. Dvornic, P. R.; de Leuze-Jallouli, A. M.; Owen, M. J.; Perz, S. V. ACS Symp. Ser. 2000, 729, 241.
20. Dvornic, P. R.; de Leuze-Jallouli, A. M.; Owen, M. J.; Perz, S. V. Macromolecules 2000, 33, 5366.
21. de Leuze-Jallouli, A. M.; Swanson, D. R.; Perz, S. V.; Owen, M. J.; Dvornic, P. R. Polym. Mater. Sci. Eng. 1997, 77, 67.
22. de Leuze-Jallouli, A. M.; Swanson, D. R.; Dvornic, P. R.; Perz, S. V.; Owen, M. J. Polym. Mater. Sci. Eng. 1997, 77, 93.
23. Dvornic, P. R.; de Leuze-Jallouli, A. M.; Perz, S. V.; Owen, M. J. Mol. Cryst. Liq. Cryst. 2000, 353, 223.
24. Dvornic, P. R.; Owen, M. J.; Keinath, S. E.; Hu, J.; Hoffman, L. W.; Parham, P. L. Polym. Prepr. 2001, 42, (1), 126.
25. Dvornic, P. R.; Hu, J.; Reeves, S. D.; Owen, M. J. Silicon Chem., in press.
26. Dvornic, P. R.; de Leuze-Jallouli, A. M.; Owen, M. J.; Perz, S. V. Polym. Prepr. 1998, 39 (1), 473.
27. Dvornic, P. R.; de Leuze-Jallouli, A. M.; Owen, M. J.; Perz, S. V. Polym. Prepr. 1999, 40 (1), 408.
28. Dvornic, P. R.; de Leuze-Jallouli, A. M.; Owen, M. J.; Perz, S. V. U.S. Pat. 5,902,863, 1999.
29. Dvornic, P. R.; de Leuze-Jallouli, A. M.; Owen, M. J.; Dalman, D. A.; Parham, P.; Pickelman, D.; Perz, S. V. Polym. Mater. Sci. Eng. 1999, 81, 187.
30. Newkome, G. R.; Moorefield, C. N.; Vögtle, F. In Dendrimers and Dendrons, Concepts, Synthesis, Applications; Wiley-VCH Verlag: Weinheim, Germany, 2001; Chapter 9 pp 539-562.
31. Tomalia, D. A.; Naylor, A. N.; Goddard, III, W. A. Angew. Chem., Int. Ed. Engl. 1990, 29 (2), 138.
32. Tomalia, D. A.; Durst, H. D. Top. Cur. Chem. 1993, 165, 193.
33. Wooley, K. L. J. Polym. Sci., Part A: Polym. Chem. 2000, 38, 1397.
34. Tomalia, D. A.; Fréchet, J. M.-J. In Dendrimers and Other Dendritic Polymers; Fréchet, J. M.-J., Tomalia, D. A., Eds.; John Wiley and Sons: Chichester, UK, 2001, Chapter 1, pp 3-44.
35. Reetz, M. T.; Giebel, D. Angew. Chem., Int. Ed. 2000, 39, 2498.
36. Watanabe, S.; Regen, S. L. J. Am. Chem. Soc. 1994, 116, 8855.
37. Kriesel, J. W.; Tilley, T. D. Chem. Mater. 1999, 11, 1190.
38. Owens, D. K.; Wendt, R. C. J. Appl. Polym. Sci. 1969, 13, 1741.
39. Bubeck, R. A.; Bauer, B. J.; Dvornic, P. R.; Owen, M. J.; Reeves, S. D.; Parham, P. L.; Hoffman, L. W. Polym. Mater. Sci. Eng. 2001, 84, 866.
40. Brinker, C. J.; Scherer, G. W. Sol-Gel Science: The Physics and Chemistry of Sol-Gel Processing; Academic Press: San Diego, 1990.
41. Sol-Gel Derived Materials; Ying, J. Y., Ed.;
42. Chem. Mater. Spec. Issue 1997, 9 (11)
43. Ruckenstein, E.; Yin, W. J. Polym. Sci., Part A: Polym. Chem. 2000, 38, 1443.
44. Dvornic, P. R. Thermal Properties of Polysiloxanes. In Silicon-Containing Polymers; Jones, R. G., Ando, W., Chojnowski, J., Eds.; Kluwer Academic Publishers: Dordrecht, The Netherlands, 2000; pp 185-213.
45. Dvornic, P. R.; de Leuze-Jallouli, A. M.; Swanson, D.; Owen, M. J.; Perz, S. V. U.S. Pat. 5,739,218, 1998.
46. Dvornic, P. R.; Lenz, R. W. High-Temperature Siloxane Elastomers; Hüthig & Wepf: Basel, Switzerland, 1990
47. Dvornic, P. R.; Uppuluri, S. Rheology and Solution Properties of Dendrimers. In Dendrimers and Other Dendritic Polymers; Fréchet, J. M.-J., Tomalia, D. A., Eds.; John Wiley and Sons: Chichester, UK, 2001; pp 331-360.
48. Balogh, L.; de Leuze-Jallouli, A. M.; Dvornic, P. R.; Owen, M. J.; Perz, S. V.; Spindler, R. U.S. Pat. 5,938,934, 1999.