High temperature fatigue crack growth behavior of Ti-6Al-4V

High Temperature Materials and Processes

Volumn 21, Issue 4, 2002, Pages 229-236

  Arakere, N K ^a   Goswami, T ^b   Krohn, J ^b   Ramachandran, N ^c  

^a UNIVERSITY OF FLORIDA   (United States)

^b ARKANSAS TECH UNIVERSITY   (United States)

^c CESSNA AIRCRAFT COMPANY   (United States)

Author keywords

CT specimen; DCPD; Fatigue Crack Growth Rate (FCGR); High Temperature; Low Cycle Fatigue; Ti 6Al 4V

Indexed keywords

CRACKS; DATA ACQUISITION; FATIGUE OF MATERIALS; FRACTOGRAPHY; PERSONAL COMPUTERS;

FATIGUE CRACK GROWTH RATE (FCGR);

TITANIUM ALLOYS;

EID: 0036997256     PISSN: 03346455     EISSN: None     Source Type: Journal    
DOI: 10.1515/HTMP.2002.21.4.229     Document Type: Article

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