Physical properties of barrier ribs of plasma display panels: II, effects of fillers

Journal of the American Ceramic Society

Volumn 85, Issue 12, 2002, Pages 2961-2964

  Hwang, Geon Ho ^a   Kim, Won Yong ^a   Jeon, Hyung Jo ^a   Kim, Yong Seog ^a  

^a Hong Ik University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; FILLERS; FRACTURE; LEAD COMPOUNDS; PERMITTIVITY; PLASMA DISPLAY DEVICES; POWDERS; QUARTZ; SINTERING; THERMAL EXPANSION; VOLUME FRACTION; WETTING;

FRACTURE RESISTANCE; LEAD BOROSILICATE; PLASMA DISPLAY PANEL; THERMAL EXPANSION COEFFICIENT; WETTING ANGLE;

GLASS;

EID: 0036967003     PISSN: 00027820     EISSN: None     Source Type: Journal    
DOI: 10.1111/j.1151-2916.2002.tb00563.x     Document Type: Article

References (9)

1. A. S. Shaikh, K. W. Allison, and T. K. Williams, "Methods of Making Plasma Display Panels," U.S. Pat. No. 5 906 527, 1999.
2. R. Buchanan, "Properties of Ceramic Insulators"; pp. 4-6 in Ceramic Materials for Electronics, 2nd Ed. Edited by R. Buchanan, Marcel Dekker, New York, 1991.
3. G. W. Scherer, "Sintering with Rigid Inclusions," J. Am. Ceram. Soc., 70 [10] 719-25 (1987).
4. M. N. Rahaman and L. C. De Jonghe, "Effect of Rigid Inclusions on the Sintering of Glass Powder Compacts," J. Am. Ceram. Soc., 70 [12] C-348-C-351 (1987).
5. G.-H. Hwang, H.-J. Jeon, and Y.-S. Kim, "Physical Properties of Barrier Ribs of Plasma Display Panels: I. Formation of Pores during Sintering of Lead Borosilicate Glass Frits," J. Am. Ceram. Soc., 85 [12] 2956-60 (2002).
6. Y.-H. Kim, H.-W. Lee, and Y.-S. Kim, "Formation of Barrier Ribs of Plasma Display Panels by Sandblasting Green Tapes," 2002 Digest of Society for Information Display, in press.
7. Y.-K. Lee, C.-S. Kang, J.-K Yoo, B.-G. Ryu, and D.-H. Ahn, "A Study on Properties of Glass-Ceramics for Thick Dielectric Layer in PDP Device," J. Korean Inst. Met. Mater., 36 [10] 1692-710 (1998).
8. W. D. Kingery, H. K. Bowen, and D. R. Uhlman, Introduction to Ceramics; p. 604 Wiley, New York, 1976.
9. ibid, p. 948.