Roughness analysis of CVD Cu films on different substrates by AFM imaging

Journal of Materials Engineering and Performance

Volumn 11, Issue 6, 2002, Pages 622-624

  Alver, Ümit ^a  

^a KAHRAMANMARAS SUTCU IMAM UNIVERSITY   (Turkey)

Author keywords

AFM; Cu; CVD; Roughness measurement

Indexed keywords

ATOMIC FORCE MICROSCOPY; CHEMICAL VAPOR DEPOSITION; ROUGHNESS MEASUREMENT; SUBSTRATES; THIN FILMS;

COPPER THIN FILMS; FILM MORPHOLOGY; ROUGHNESS ANALYSIS; SEED LAYER EFFECTS;

COPPER;

EID: 0036962172     PISSN: 10599495     EISSN: None     Source Type: Journal    
DOI: 10.1361/105994902770343601     Document Type: Article

References (7)

1. P.L. Pai and C.H. Ting: "Selective Electroless Copper for VLSI Interconnection," IEEE Electron Devices Lett., 1989, 10(9), pp. 423-25.
2. M. Suzuki and Y. Taga: "Giant Magnetoresistance in Co/Cu Superlattices with Mixed Interfaces," J. Appl. Phys. Lett., 1993, 74(7), pp. 4660-63.
3. G. Binnig, C.F. Quate, and Ch. Gerber: "Atomic Force Microscope," Phys. Rev. Lett., 1986, 56, pp. 930-33.
4. R. Thiruvenkatachari: "Chemical Vapor Deposition of Copper Thin Films," M.S. Thesis, Louisiana State University, Baton Rouge, LA, 2000.
5. N. Awaya and Y. Arita: "Double Level Copper Interconnections Using Selective Copper CVD," J. Electron. Mater. 1992, 21(10), pp. 959-64.
6. J.Y. Kim, P.J. Reucroft, and D.K. Park: "Nucleation and Growth Mechanism of Copper MOCVD Film on Au/Si Substrates," Thin Solid Films, 1996, 289, pp. 184-91.
7. L.Z. Mezey and J. Giber: "The Surface Free-Energies of Solid Chemical Elements Calculations From Internal Free Enthalpies of Atomization," Jpn. J. App. Phys., 1982, 21(11), pp. 1569-71.