Dynamic recrystallization at triple junction during high-temperature deformation in copper tricrystal

Materials Science Forum

Volumn 408-412, Issue I, 2002, Pages 761-766

  Andiarwanto, Sutandyo ^a   Miura, Hiromi ^a   Sakai, Taku ^a  

^a UNIVERSITY OF ELECTRO COMMUNICATIONS   (Japan)

Author keywords

Copper; Dynamic Recrystallization; High Temperature; Tensile Deformation; Tricrystal; Triple Junctions

Indexed keywords

COPPER; DEFORMATION; GRAIN BOUNDARIES; HIGH TEMPERATURE EFFECTS; NUCLEATION; RECRYSTALLIZATION (METALLURGY); STRAIN; STRESS ANALYSIS;

TRICRYSTALS;

CRYSTALS;

EID: 0036955753     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.408-412.761     Document Type: Conference Paper

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