Control of a metal-electrode work function by solid-state diffusion of nitrogen

Materials Research Society Symposium - Proceedings

Volumn 716, Issue , 2002, Pages 253-258

  Lander, R J P ^a   Hooker, J C ^a   Van Zijl, J P ^a   Roozeboom, F ^a   Maas, M P M ^a   Tamminga, Y ^a   Wolters, R A M ^a  

^a PHILIPS RESEARCH LABORATORIES   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINA; ANNEALING; DIELECTRIC MATERIALS; DIFFUSION IN SOLIDS; INTERFACES (MATERIALS); NITROGEN; RUTHERFORD BACKSCATTERING SPECTROSCOPY; SPUTTERING; STOICHIOMETRY; TANTALUM COMPOUNDS; THERMAL EFFECTS;

METAL ELECTRODE WORK FUNCTION; SOLID STATE DIFFUSION;

TITANIUM NITRIDE;

EID: 0036945758     PISSN: 02729172     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1557/proc-716-b5.11     Document Type: Conference Paper

References (6)

1. H. Wakabayashi et al., IEDM Tech. Dig. 1999, pp. 253.
2. Q. Lu et al., Symp. on VLSI Tech 2001, pp. 45.
3. R. Lin et al., IEEE Electron Device Lett., 23, 2002, pp. 49.
4. F.R. de Boer et al., "Cohesion in Metals: Transition Metal Alloys", North Holland, 1988.
5. Hauser Model, J. R. Hauser and A. Ahmed, Conference on characterization and metrology for ULSI technology: 1998, pp. 235.
6. Y.-C. Yeo, et al., Symp. on VLSI Tech 2001, pp. 49.