High density VCSEL arrays

Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS

Volumn 1, Issue , 2002, Pages 129-130

  Gulden, K H ^a   Eitel, S ^a   Hunziker, S ^a   Vez, D ^a   Gimkiewicz, C ^a   Gale, M T ^a   Moser, M ^a  

^a Bookham Inc   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

AMPLITUDE MODULATION; BANDWIDTH; CMOS INTEGRATED CIRCUITS; ELECTRIC CURRENTS; LENSES; OPTICAL LINKS; SCANNING ELECTRON MICROSCOPY; SEMICONDUCTOR LASERS;

THRESHOLD CURRENT; VERTICAL CAVITY SURFACE EMITTING LASERS;

OPTICAL INTERCONNECTS;

EID: 0036929752     PISSN: 10928081     EISSN: None     Source Type: Journal    
DOI: 10.1109/LEOS.2002.1133952     Document Type: Article

References (3)

1. M. Sundaram and A. Reisinger, “VCSELs: Crucial Components in High-Density Interconnection”, Fiberoptic Product News, Jan. 2002.
2. M. Grabherr et al., “Speed it up to 10 Gb/s and flip chip it: VCSELs today”, Proc SPIE, vol. 4649, pp. 11-18, 2002.
3. S. Eitel et al., “Highly Uniform Vertical-Cavity Surface-Emitting Lasers Integrated with Microlens Arrays”, IEEE Photon. Techn. Lett., vol. 12, pp.459-461, 2000.