Uncooled amorphous silicon technology: High performance achievement and future trends

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4721, Issue , 2002, Pages 56-63

  Mottin, E ^a   Bain, A ^a   Martin, J L ^a   Ouvrier Buffet, J L ^a   Yon, J J ^a   Chatard, J P ^b   Tissot, J L ^b  

^a CEA LETI   (France)

^b ULIS   (France)

Author keywords

Amorphous silicon; Focal plane array; Microbolometer; Packaging

Indexed keywords

AMORPHOUS SILICON; BOLOMETERS; CAMERAS; CMOS INTEGRATED CIRCUITS; DEPOSITION; ETCHING; IMAGE SENSORS; INFRARED IMAGING; POLYIMIDES; READOUT SYSTEMS; SUBSTRATES; THERMOMETERS;

FOCAL PLANE ARRAY; MICROBOLOMETER; READOUT CIRCUIT ARCHITECTURE DESIGN;

INFRARED DETECTORS;

EID: 0036911631     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.478861     Document Type: Conference Paper

References (2)

1. J.L. Tissot et al, "320×240 microbolometer uncooled IRFPA development", SPIE Vol. 4130, Infrared technology and Applications XXVI pp. 473-479, 2000
2. IEEE transactions on electron devices VOL 41 no 11, November 11, 1994w