Wavelet analysis based deconvolution to improve the resolution of scanning acoustic microscope images for the inspection of thin die layer in semiconductor

NDT and E International

Volumn 35, Issue 8, 2002, Pages 549-557

  Jhang, Kyungyoung ^a   Jang, Hyoseong ^b   Park, Byungil ^a   Ha, Job ^a   Park, Ikkeun ^c   Kim, Kyungsuk ^d  

^a Hanyang University   (South Korea)

^b Sonix Korea   (South Korea)

^c Seoul National University of Science and Technology   (South Korea)

^d Chosun University   (South Korea)

Author keywords

Deconvolution; Resolution; Scanning acoustic microscope (SAM); Semiconductor; Wavelet analysis

Indexed keywords

ACOUSTIC MICROSCOPES; COMPUTER SIMULATION; DIES; SEMICONDUCTOR MATERIALS; SIGNAL PROCESSING; WAVEFORM ANALYSIS; WAVELET TRANSFORMS;

SCANNING ACOUSTIC MICROSCOPY (SAM);

NONDESTRUCTIVE EXAMINATION;

EID: 0036897273     PISSN: 09638695     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0963-8695(02)00028-2     Document Type: Article

References (8)

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