Electromigration and diffusion of gold in GaAs IC interconnections

IEICE Transactions on Electronics

Volumn E85-C, Issue 11, 2002, Pages 1932-1939

  Ohta, Akira ^a   Yajima, Kotaro ^a   Higashisaka, Norio ^a   Heima, Tetsuya ^a   Hisaka, Takayuki ^a   Hattori, Ryo ^a   Nakayama, Yoshikazu ^b  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

^b Osaka Prefecture University   (Japan)

Author keywords

Diffusion; Electromigration; GaAs IC; High current density; High temperature

Indexed keywords

CATHODES; CURRENT DENSITY; DIFFUSION IN SOLIDS; ELECTROMIGRATION; GOLD; INTEGRATED CIRCUITS; SEMICONDUCTING GALLIUM ARSENIDE;

HIGH CURRENT DENSITY;

INTERCONNECTION NETWORKS;

EID: 0036881774     PISSN: 09168524     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Conference Paper

References (11)

1. R. Rosenberg, "Value DOZ* for grain boundary electromigration in aluminum films," Appl. Phys. Lett., vol.16, pp.27-29, 1970.
2. D. Gupta, "Grain-boundary self diffusion in Au by Ar sputtering technique," J. Appl. Phys., vol.44, pp.4455-4458, 1973.
3. J.R. Black, "Electromigration - A brief survey and some recent results," IEEE Trans. Electron Devices, vol.ED-16, no.4, pp.338-347, 1969.
4. F.M. D'Heurale, "Electromigration and failure in electronics: An Introduction," Proc. IEEE, vol.59, no.10, pp.1409-1471, Oct. 1971.
5. I.A. Blech and E.S. Meleran, "Electromigration in thin Al films," J. Appl. Phys., vol.40, no.2, pp.485-491, 1969.
6. J. Tao and B.-K. Liew, "Electromigration under time-varying current stress," Microelectron. Reliab., vol.38, no.3, pp.295-308, 1998.
7. I.A. Blech and C. Herring, "Stress generation by electromigration," Appl. Phys. Lett., vol.29, no.3, pp.131-133, 1976.
8. A. Blech and E. Kinsbron, "Electromigration in thin gold films on molybdenum surfaces," Thin Solid Films, vol.25, pp.327-334, 1975.
9. K. Nikawa, "Monte Carlo calculations based on the generalized electromigration failure model," IEEE Int. Reliab. Phys. Symp., vol.CH 1619-6, pp.175-181, 1981.
10. A. Ohta, K. Yajima, N. Higashisaka, T. Heima, T. Hisaka, and N. Tanino, "Electromigration in gold lines of GaAs ICs," Proc. 24th ISTFA, pp.279-285, 1998.
11. M. Rocchi, High-speed digital IC technologies, Artech House, Boston and London, 1990.